★ Key Applications
- Virtualization
- HPC
- Cloud Computing
- High End Enterprise Server
- Software Defined Storage
- Application Tier Service Provider
- 5G/Telco
★ Key Features
- Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
- Flexible networking options
- 12x 3.5″ hot-swap hybrid NVMe/SATA/SAS drive bays
- 4 heavy duty fans with optimal fan speed control
- 1200W redundant Titanium level power supplies
| Item | Technical Specifications |
| Form Factor | 2U Rackmount |
| Processor | Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors |
| Memory | Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 3200MT/s ECC DDR4 RDIMM/LRDIMM Supports Intel® Optane™ persistent memory 200 series |
| GPU | Up to 4 double-width or 6 single-width GPU(s) |
| Hard Disk | 12 front hot-swap 3.5″ NVMe/SAS*/SATA drive bay(s) |
| Expansion | 1 PCIe 4.0 x16 (in x16) FH/10.5″L slot(s) 5 PCIe 4.0 x8 (in x8) FH/10.5″L slot(s) 1 PCIe 4.0 x8 (in x8) LP slot(s) 1 PCIe 4.0 x16 (in x16) LP slot(s) |
| I/O | LAN 1 RJ45 1 GbE Dedicated BMC LAN port(s) USB 2 USB 3.0 port(s) (rear) Video 1 VGA port(s) DOM 2 SuperDOM (Disk on Module) port(s) |
| Networking | 2 RJ45 10GBASE-T with Intel® X710-AT2 (optional) 2 RJ45 10GBASE-T with Intel® X710-TM4 (optional) 2 SFP+ 10GbE with Intel® X710-TM4 (optional) No NIC option supported |
| Power Supply | 1x 1200W Redundant Titanium Level (96%) Hot-plug power supply |
| Dimensions | 659.4mm (depth) x 432mm (width) x 88.1mm (height) |
| Power Supply | Standard 800W redundant power supply, optional 550W redundant power supply |
| Note | This document is for reference only, and actual configuration shall be subject to negotiation and agreement. |
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