• AS-2124US-TNRP Roystor High-Density Server
  • AS-2124US-TNRP Roystor High-Density Server

AS-2124US-TNRP Roystor High-Density Server

★ 2U 4-Node High-Density Server
★ Supports AMD EPYC 7003/7002 Series Processors
★ 2 PCI-E 4.0 x16 LP Slots
★ High-Density, Efficient, Reliable, and Intelligent
★ Applicable for Cloud Computing, Hyperconverged, Web Applications, etc.

★ New Processing Architecture
Supports the latest AMD Milan processors, providing users with higher performance for various applications. Compared to Intel processors, it can support up to 64 cores and DDR4 3200 memory, greatly improving system performance. The processor has a higher level of cache, up to 256M, increasing the read and write speed between the processor and memory, significantly improving CPU and memory cooperation efficiency.

★ Strong Processing Performance
Integrated with an 8-channel memory controller and supports up to DDR4 3200MHz memory. A single CPU can provide up to 64-core computing power, significantly improving computing performance. The memory capacity can be expanded up to 4TB, providing flexible and powerful memory configuration options.

★ Expandability
2 PCI-E 4.0×16 (LP) slots provide expansion interfaces for network cards, IB cards, and other expansion needs. It is suitable for various application scenarios such as high-performance computing, cloud computing, hyperconvergence, virtualization, etc., and can better meet customers’ complex application scenarios and requirements.

★ High Density
4 independent nodes are integrated in a 2U space, integrating high performance, high density, and high reliability.

Applications: Suitable for industries such as the Internet, education, finance, research, and healthcare, especially for applications in the fields of cloud computing, hyperconvergence, web-based applications, and high-performance computing.

SpecificationTechnical Details
Form Factor2U rack-mounted server with four nodes
ProcessorSupports AMD EPYC™ 7003/7002 series processors with large cache (256/192/128/64MB, varies by CPU model). Supports up to 225W TDP CPU (with rated restrictions for above 200W)
MemorySingle node with 16 memory slots. Supports DDR4 RDIMM/LRDIMM 3200/2933/2666 ECC memory (working frequency varies depending on CPU and memory configuration). Maximum expandable memory up to 4TB, supports RDIMM and LRDIMM
ChipsetSystem on Chip
Hard DiskSingle node supports 6 hot-swappable 2.5-inch SATA hard disks or 4 NVME + 2 SATA, 1 SATA 2280 22110 M.2 PCI-E 3.0 x4
Expansion SlotsSupports up to 2 PCIe expansion slots (2 PCI-E 4.0 x16 (LP))
I/OSingle-node with 1 RJ-45 management interface located at the rear of the chassis, 2 USB 3.0 interfaces located at the rear of the chassis, and 1 VGA interface located at the rear of the chassis
NetworkAppropriate SIOM can be selected according to demand
Power SupplySupports 2200W (1+1) titanium redundant power supply
RemarksThe above standard configuration data is for reference only. Please refer to the actual product configuration plan.

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