Key Applications
– High Performance Computing
– AI / Deep Learning
Key Features
1.Supports NVIDIA® HGX™ A100 8-GPU;
Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™;
NICs for GPUDirect RDMA (1:1 GPU Ratio)
2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e)
3.Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
5.8 PCI-E 4.0 x16 via PCI-E switch;
1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs;
AIOM Support6.6 Hot-swap U.2 NVMe 2.5″ drive bays
(4 via PCI-E switch, 2 via CPU)
Up to 10 U.2 NVMe 2.5″ drives available with an optional 4 drive bays at rear of system7.Flexible Networking via AIOM,
1 dedicated IPMI LAN Port8.4 Hot-swap heavy-duty cooling fans9.2200W (3+1) Redundant Platinum Level
Power Supplies (full redundancy based on configuration and application load);
3000W (2+2) Redundant Titanium Level (96%+) Power Supply option available for upgrade
Form Factor | 4U Rackmountable Rackmount Kit (MCP-290-00180-0N) |
CPU | Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) Socket SP3 Supports CPU TDP up to 280W* |
GPU | 8-GPU 40GB/80GB |
Memory | 32 DIMM slots Up to 8TB 3DS ECC DDR4-3200MH RDIMM/LRDIMM |
Input / Output | SATA 4 SATA3 (6Gbps) ports LAN Provided by AIOM 1 RJ45 Dedicated IPMI LAN port USB 2 USB 3.0 ports (front) Video 1 VGA Connector (front) COM Port 1 COM port (header) |
PCI-Express | 8 PCI-E 4.0 x16 via PCI-E switch – supporting 8-GPU’s 1:1 connection to 8 NICs 1 PCI-E 4.0 x16 LP and 1 PCI-E 4.0 x8 LP via CPUs |
Drive Bays | 6 hot-swap U.2 NVMe 2.5″ drive bays (4 via PCI-E switch, 2 via CPU, SATA/NVMe Hybrid or SAS with optional HBA) (up to 10 hot-swap U.2 NVMe 2.5″ available) |
Power Supply | 2200W Redundant Platinum Level Power Supplies |